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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AD8224HBCPZ-RL датащи(PDF) 9 Page - Analog Devices |
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AD8224HBCPZ-RL датащи(HTML) 9 Page - Analog Devices |
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9 / 28 page  AD8224 Rev. B | Page 9 of 28 ABSOLUTE MAXIMUM RATINGS Table 8. Parameter Rating Supply Voltage ±18 V Power Dissipation See Figure 2 Output Short-Circuit Current Indefinite1 Input Voltage (Common Mode) ±VS Differential Input Voltage ±VS Storage Temperature Range −65°C to +130°C Operating Temperature Range2 −40°C to +125°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 130°C Package Glass Transition Temperature 130°C ESD (Human Body Model) 4 kV ESD (Charge Device Model) 1 kV ESD (Machine Model) 0.4 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 1 Assumes the load is referenced to midsupply. 2 Temperature for 85°C. For performance to 125°C, see the section. specified performance is −40°C to + Typical Performance Characteristics THERMAL RESISTANCE Table 9. Exposed Paddle Package θJA Unit CP-16-13: LFCSP Soldered to Board 48 °C/W CP-16-13: LFCSP Not Soldered to Board 86 °C/W Table 10 . Hidden Paddle Package θJA Unit CP-16-19: LFCSP 86 °C/W The θJA values in Table 9 and Table 10 assume a 4-layer JEDEC standard board. If the thermal pad is soldered to the board, it is also assumed it is connected to a plane. θJC at the exposed pad is 4.4°C/W. Maximum Power Dissipation The maximum safe power dissipation for the AD8224 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 130°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a temperature of 130°C for an extended period can result in a loss of functionality. Figure 2 shows the maximum safe power dissipation in the package vs. the ambient temperature for the LFCSP on a 4-layer JEDEC standard board. 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 –60 –40 –20 0 20 40 60 80 100 120 140 AMBIENT TEMPERATURE (°C) θJA = 48°C/W WHEN THERMAL PAD IS SOLDERED TO BOARD θJA = 86°C/W WHEN THERMAL PAD IS NOT SOLDERED TO BOARD Figure 2. Maximum Power Dissipation vs. Ambient Temperature ESD CAUTION |
Аналогичный номер детали - AD8224HBCPZ-RL |
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Аналогичное описание - AD8224HBCPZ-RL |
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