LC86P5632

No.6688-7/23

Package Dimension

(unit : mm)

3159

SANYO: QIP-64E

Notes

• The QFP packages should be heat-soaked for 12 hours at 125

°C immediately prior to mounting (This baking is called

pre-baking).

• After pre-baking, a controlled environment must be maintained until soldering. The environment must be held at a

temperature of 30

°C or less and a humidity level of 70% or less. Please solder within 24 hours.

P27

P26

P25

P24

P23

P22

P21

P20

VDDVPP

VSS

P51

P50

P47

P46

P45

P44

TEST1

RES

XT2

VSS

CF1

CF2

VDD

P80/AN0

P81/AN1

P82/AN2

P83/AN3

P84/AN4

P85/AN5

P86/AN6

P87/AN7

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17