TPD4S014

www.ti.com

SLVSAU0A

– MAY 2011 – REVISED JUNE 2011

PIN FUNCTIONS

PIN

TYPE

DESCRIPTION

NAME

NO.

D

–

6

I/O

USB data

–

D+

7

I/O

USB data+

ID

5

I/O

USB ID signal

Open-Drain Adapter-Voltage Indicator Output. ACOK is driven low after the VIN voltage is stable

ACK

4

O

between UVLO and OVLO for 16ms (typ). Connect a pullup resistor from ACOK to the logic I/O

voltage of the host system.

EN

3

I

Enable Active-Low Input. Drive EN low to enable the switch. Drive EN high to disable the switch.

VBUS

9, 10

USB Input

USB connector VBUS

Power

VCC

1, 2

Power Output Connect to PCB internal PCB plane

GND

8

Ground

Connect to PCB ground plane

Central

Central

Heat Sink

Electrically disconnected. Use as heat sink. Connect to GND plane via large PCB PAD

PAD

PAD

ABSOLUTE MAXIMUM RATINGS

(1) (2)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

MAX

–0.5

30

V

Continuous current through NFET

2.6

A

Max Current through D+, D-, ID, VBUS ESD clamps

-50

mA

Continuous current through logic output

–50

50

mA

Maximum junction temperature

–40

150

°C

IEC 61000-4-2 Contact Discharge

D+, D

–, ID, VBUS pins

±15

kV

IEC 61000-4-2 Air-gap Discharge

D+, D

–, ID, VBUS pins

±15

kV

Human-Body Model

EN, ACK, VCC pins

±2

kV

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

THERMAL INFORMATION

TPD4S014

UNITS

DSQ (10) PINS

Junction-to-ambient thermal resistance

70.3

Junction-to-case (top) thermal resistance

46.3

Junction-to-board thermal resistance

33.8

°C/W

Junction-to-top characterization parameter

2.9

Junction-to-board characterization parameter

33.5

Junction-to-case (bottom) thermal resistance

16.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright

© 2011, Texas Instruments Incorporated

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