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Z0103NN0 датащи(PDF) 6 Page - NXP Semiconductors |
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Z0103NN0 датащи(HTML) 6 Page - NXP Semiconductors |
6 / 15 page Z0103NN0 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 02 — 21 March 2011 6 of 15 NXP Semiconductors Z0103NN0 4Q Triac 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point full cycle; see Figure 8 --15 K/W Rth(j-a) thermal resistance from junction to ambient in free air; printed-circuit board mounted: minimum footprint; full cycle; see Figure 6 - 156 - K/W in free air; printed-circuit board mounted: pad area; full cycle; see Figure 7 -70 - K/W All dimensions are in mm All dimensions are in mm Printed circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick) Fig 6. Minimum footprint SOT223 Fig 7. Printed circuit board pad area: SOT223 001aab508 3.8 min 1.5 min 1.5 min (3 ×) 2.3 4.6 6.3 1.5 min 001aab509 7 4.6 15 36 9 10 18 4.5 60 50 |
Аналогичный номер детали - Z0103NN0 |
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Аналогичное описание - Z0103NN0 |
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