TMP708

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SBOS585A

– DECEMBER 2011 – REVISED FEBRUARY 2012

APPLICATION INFORMATION

determined using either Figure 2 or from Equation 1:

Where T = temperature threshold in degree Celsius.

(1)

THERMAL CONSIDERATIONS

The TMP708 quiescent current is typically 40

μA. The device dissipates negligible power when the output drives

a high-impedance load. Thus, the die temperature is the same as the package temperature. In order to maintain

accurate temperature monitoring, a good thermal contact should be provided between the TMP708 package and

the device being monitored. The rise in die temperature as a result of self-heating is given by the following

equation:

Where:

(2)

To limit the effects of self-heating, keep the output current at a minimum level.

POWER-SUPPLY FILTERING

Any significant noise on the VCC pin may result in a trip-point error. This noise can be minimized by low-pass

Copyright

© 2011–2012, Texas Instruments Incorporated

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Product Folder Link(s): TMP708