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AD8108 датащи(PDF) 5 Page - Analog Devices |
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AD8108 датащи(HTML) 5 Page - Analog Devices |
5 / 28 page AD8108/AD8109 –5– REV. 0 WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8108/AD8109 features proprietary ESD protection circuitry, permanent dam- age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.0 V Internal Power Dissipation2 AD8108/AD8109 80-Lead Plastic TQFP (ST) . . . . . 2.6 W Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V S Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range . . . . . . . . . . . . –65 °C to +125°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air (T A = +25°C): 80-lead plastic TQFP (ST): θ JA = 48°C/W. ORDERING GUIDE Temperature Package Package Model Range Description Option AD8108AST –40 °C to +85°C 80-Lead Plastic TQFP (12 mm × 12 mm) ST-80A AD8109AST –40 °C to +85°C 80-Lead Plastic TQFP (12 mm × 12 mm) ST-80A AD8108-EB Evaluation Board AD8109-EB Evaluation Board MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8108/AD8109 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plas- tic encapsulated devices is determined by the glass transition temperature of the plastic, approximately +150 °C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the pack- age. Exceeding a junction temperature of +175 °C for an ex- tended period can result in device failure. While the AD8108/AD8109 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junc- tion temperature (+150 °C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maxi- mum power derating curves shown in Figure 3. AMBIENT TEMPERATURE – C 5.0 4.0 0 –50 80 –40 –30 –20 –10 0 10 20 30 40 50 60 70 3.0 2.0 1.0 TJ = 150 C 90 Figure 3. Maximum Power Dissipation vs. Temperature |
Аналогичный номер детали - AD8108 |
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Аналогичное описание - AD8108 |
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