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AD8195ACPZ датащи(PDF) 5 Page - Analog Devices |
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AD8195ACPZ датащи(HTML) 5 Page - Analog Devices |
5 / 20 page Data Sheet AD8195 Rev. B | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating AVCC to AVEE 3.7 V VTTI AVCC + 0.6 V VTTO AVCC + 0.6 V AMUXVCC 5.5 V VREF_IN 5.5 V VREF_OUT 5.5 V Internal Power Dissipation 1.81 W High Speed Input Voltage AVCC − 1.4 V < VIN < AVCC + 0.6 V High Speed Differential Input Voltage 2.0 V Parallel Control Input Voltage AVEE − 0.3 V < VIN < AVCC + 0.6 V Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Junction Temperature 150°C ESD, Human Body Model Input Pins Only ±5 kV All Other Pins ±3 kV Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE Table 5. Package θJA θJC Unit 40-Lead LFCSP_VQ 36 5.0 °C/W MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8195 is limited by the associated rise in junction temperature. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition temperature of the plastic, approximately 150°C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of 175°C for an extended period can result in device failure. To ensure proper operation, it is necessary to observe the maximum power derating as determined by the thermal resistance coefficients. ESD CAUTION |
Аналогичный номер детали - AD8195ACPZ |
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Аналогичное описание - AD8195ACPZ |
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