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VJ20M00170K датащи(PDF) 10 Page - AVX Corporation

номер детали VJ20M00170K
подробное описание детали  Glass Encapsulated SMD Varistor MLV
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производитель  AVX [AVX Corporation]
домашняя страница  http://www.avx.com
Logo AVX - AVX Corporation

VJ20M00170K датащи(HTML) 10 Page - AVX Corporation

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24
Glass Encapsulated SMD Varistor MLV
(VJ13, 14, 15, 20)
Surface Mounting Guide
SURFACE MOUNTING GUIDE (VJ13, 14, 15, 20)
APPLICATIONS NOTES
SOLDERABILITY/LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235±5ºC for 2±1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as
bright as with tin-lead pastes and the fillet may not be as
large.
b) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to
be modified.
P/N
Termination Type
Solder
Solder
Immersion
Tin/Lead
Temp. ºC
Time (sec)
VC
Unplated MLV
60/40
260±5
15 max
Hybrid Termination
Plated MLV
VJ
Nickel and Matte Tin
60/40
260±5
30±1
Plating Termination
Unplated MLV
Plated MLV
Thick
Film
Material
VC
Electrodes
Solder Layer
Nickel Layer
Thick
Film
Material
VJ
Electrodes
D1
D2
D3
D4
D5
Case
D1
D2
D3
D4
D5
Size
1206
4.00 (0.157) 1.00 (0.039)
2.00 (0.079) 1.00 (0.039)
1.06 (0.042)
1210
4.00 (0.157) 1.00 (0.039)
2.00 (0.079) 1.00 (0.039)
2.05 (0.081)
1812
5.60 (0.220) 1.00 (0.039)
3.60 (0.142) 1.00 (0.039)
3.00 (0.118)
2220
6.60 (0.260) 1.00 (0.039)
4.60 (0.181) 1.00 (0.039)
5.00 (0.197)
3220
10.21 (0.402) 2.21 (0.087)
5.79 (0.228) 2.21 (0.087)
5.50 (0.217)
REFLOW SOLDERING
Dimensions in mm (inches)
Case
D1
D2
D3
D4
D5
Size
1206
5.00 (0.197) 1.50 (0.059)
2.00 (0.079) 1.50 (0.059)
1.06 (0.042)
1210
5.00 ( 0.197) 1.50 (0.059)
2.00 (0.079) 1.50 (0.059)
2.05 (0.081)
1812
6.60 (0.260) 1.50 (0.059)
3.60 (0.142) 1.50 (0.059)
3.00 (0.118)
2220
7.60 (0.299) 1.50 (0.059)
4.60 (0.181) 1.50 (0.059)
5.00 (0.197)
3220
11.21 (0.441) 1.50 (0.059)
5.79 (0.228) 1.50 (0.059)
5.50 (0.217)
WAVE SOLDERING
Dimensions in mm (inches)
RECOMMENDED
SOLDER PAD
LAYOUT
300
250
200
150
100
50
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
MAXIMUM TEMPERATURE 260ºC
20 - 40 SECONDS WITH 5ºC
RAMP RATE
< 3ºC/s
PREHEAT ZONE
60 - 150 SEC
> 217ºC
VJ Products Lead-Free Reflow Profile
RECOMMENDED SOLDERING PROFILES
VJ products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes and peak temperatures up to 270ºC.
Recommended profiles for reflow and wave soldering are
show below for reference.
VC products are recommended for lead soldering applica-
tion or gluing techniques.


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