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VJ20M00170K датащи(PDF) 10 Page - AVX Corporation |
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VJ20M00170K датащи(HTML) 10 Page - AVX Corporation |
10 / 10 page 24 Glass Encapsulated SMD Varistor MLV (VJ13, 14, 15, 20) Surface Mounting Guide SURFACE MOUNTING GUIDE (VJ13, 14, 15, 20) APPLICATIONS NOTES SOLDERABILITY/LEACHING Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235±5ºC for 2±1 seconds. Terminations will resist leaching for at least the immersion times and conditions recommendations shown below. a) The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Lead-free solder pastes do not allow the same self align- ment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. P/N Termination Type Solder Solder Immersion Tin/Lead Temp. ºC Time (sec) VC Unplated MLV 60/40 260±5 15 max Hybrid Termination Plated MLV VJ Nickel and Matte Tin 60/40 260±5 30±1 Plating Termination Unplated MLV Plated MLV Thick Film Material VC Electrodes Solder Layer Nickel Layer Thick Film Material VJ Electrodes D1 D2 D3 D4 D5 Case D1 D2 D3 D4 D5 Size 1206 4.00 (0.157) 1.00 (0.039) 2.00 (0.079) 1.00 (0.039) 1.06 (0.042) 1210 4.00 (0.157) 1.00 (0.039) 2.00 (0.079) 1.00 (0.039) 2.05 (0.081) 1812 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 3.00 (0.118) 2220 6.60 (0.260) 1.00 (0.039) 4.60 (0.181) 1.00 (0.039) 5.00 (0.197) 3220 10.21 (0.402) 2.21 (0.087) 5.79 (0.228) 2.21 (0.087) 5.50 (0.217) REFLOW SOLDERING Dimensions in mm (inches) Case D1 D2 D3 D4 D5 Size 1206 5.00 (0.197) 1.50 (0.059) 2.00 (0.079) 1.50 (0.059) 1.06 (0.042) 1210 5.00 ( 0.197) 1.50 (0.059) 2.00 (0.079) 1.50 (0.059) 2.05 (0.081) 1812 6.60 (0.260) 1.50 (0.059) 3.60 (0.142) 1.50 (0.059) 3.00 (0.118) 2220 7.60 (0.299) 1.50 (0.059) 4.60 (0.181) 1.50 (0.059) 5.00 (0.197) 3220 11.21 (0.441) 1.50 (0.059) 5.79 (0.228) 1.50 (0.059) 5.50 (0.217) WAVE SOLDERING Dimensions in mm (inches) RECOMMENDED SOLDER PAD LAYOUT 300 250 200 150 100 50 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 MAXIMUM TEMPERATURE 260ºC 20 - 40 SECONDS WITH 5ºC RAMP RATE < 3ºC/s PREHEAT ZONE 60 - 150 SEC > 217ºC VJ Products Lead-Free Reflow Profile RECOMMENDED SOLDERING PROFILES VJ products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. This includes Pb free reflow processes and peak temperatures up to 270ºC. Recommended profiles for reflow and wave soldering are show below for reference. VC products are recommended for lead soldering applica- tion or gluing techniques. |
Аналогичный номер детали - VJ20M00170K |
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Аналогичное описание - VJ20M00170K |
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