Vishay Siliconix

Si8466EDB

Document Number: 63683

S12-2183-Rev. A, 10-Sep-12

www.vishay.com

8

This document is subject to change without notice.

PACKAGE OUTLINE

MICRO FOOT 1 mm x 1 mm: 4-BUMP (2 x 2, 0.5 mm PITCH)

Notes (Unless otherwise specified):

1. All dimensions are in millimeters.

2. Four (4) solder bumps are lead (Pb)-free 95.5Sn/3.8Ag/0.7Cu with diameter Ø 0.30 mm to 0.32 mm.

3. Backside surface is coated with a Ti/Ni/Ag layer.

4. Non-solder mask defined copper landing pad.

5. •

is location of pin 1.

Notes:

a. Use millimeters as the primary measurement.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

S

D

G

S

XXX

8466

e

D

s

4 x Ø b

2

1

4

3

Recommended Land

Mark on Backside of Die

4 x Ø 0.24 to 0.26 Note 4

Solder Mask ~ Ø 0.25

Bump Note 2

Dim.

Inches

Min.

Nom.

Max.

Min.

Nom.

Max.

A

0.462

0.505

0.548

0.0181

0.0198

0.0215

0.220

0.250

0.280

0.0086

0.0098

0.0110

0.242

0.255

0.268

0.0095

0.0100

0.0105

b

0.300

0.310

0.320

0.0118

0.0122

0.0126

e

0.500

0.0197

s

0.230

0.250

0.270

0.0090

0.0098

0.0106

D

0.920

0.960

1.000

0.0362

0.0378

0.0394