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HLMP-AD06-P0TXX датащи(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-AD06-P0TXX датащи(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 12 page 9 Precautions: Lead Forming: • TheleadsofanLEDlampmaybepreformedorcutto lengthpriortoinsertionandsolderingonPCboard. • For better control, it is recommended to use proper tooltopreciselyformandcuttheleadstoapplicable lengthratherthandoingitmanually. • Ifmanualleadcuttingisnecessary,cuttheleadsafter thesolderingprocess.Thesolderconnectionformsa mechanicalgroundwhichpreventsmechanicalstress duetoleadcuttingfromtravelingintoLEDpackage. Thisishighlyrecommendedforhandsolderoperation, astheexcessleadlengthalsoactsassmallheatsink. Soldering and Handling: • CaremustbetakenduringPCBassemblyandsoldering processtopreventdamagetotheLEDcomponent. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidablecircumstancessuchasrework.Theclosest manualsolderingdistanceofthesolderingheatsource (solderingiron’stip)tothebodyis1.59mm.Soldering the LED using soldering iron tip closer than 1.59mm mightdamagetheLED. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering settingisused.So,itisrecommendedtore-calibratethesoldering profileagainbeforeloadinganewtypeofPCB. 2. AvagoTechnologies’highbrightnessLEDareusinghighefficiency LEDdiewithsinglewirebondasshownbelow.Customerisadvised to take extra precaution during wave soldering to ensure that the maximumwavetemperaturedoesnotexceed250°Candthesolder contacttimedoesnotexceeding3sec.Over-stressingtheLEDduring solderingprocessmightcauseprematurefailuretotheLEDdueto delamination. Avago Technologies LED configuration 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. DorefertoAvagoapplicationnoteAN1142fordetails. Thesolderingironusedshouldhavegroundedtipto ensureelectrostaticchargeisproperlygrounded. • Recommendedsolderingcondition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heattemperature 105°CMax. - Preheattime 60secMax - Peaktemperature 250°CMax. 260°CMax. Dwelltime 3secMax. 5secMax Note: 1) Above conditions refers to measurement with thermocouple mountedatthebottomofPCB. 2) Itisrecommendedtouseonlybottompreheatersinordertoreduce thermalstressexperiencedbyLED. • Wavesolderingparametersmustbesetandmaintained accordingtotherecommendedtemperatureanddwell time.Customerisadvisedtoperformdailycheckonthe solderingprofiletoensurethatitisalwaysconforming torecommendedsolderingconditions. Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand theleadframeisachievedthroughconductivepaste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should notapplyweightorforceonLED.Nonmetalmaterial isrecommendedasitwillabsorblessheatduringwave solderingprocess. • At elevated temperature, LED is more susceptible to mechanicalstress.Therefore,PCBmustallowedtocool down to room temperature prior to handling, which includesremovalofalignmentfixtureorpallet. • IfPCBboardcontainsboththroughhole(TH)LEDand othersurfacemountcomponents,itisrecommended that surface mount components be soldered on the topsideofthePCB.Ifsurfacemountneedtobeonthe bottom side, these components should be soldered usingreflowsolderingpriortoinsertiontheTHLED. • Recommended PC board plated through holes (PTH) sizeforLEDcomponentleads. LED component lead size Diagonal Plated through hole diameter 0.45x0.45mm (0.018x0.018inch) 0.636mm (0.025inch) 0.98to1.08mm (0.039to0.043inch) 0.50x0.50mm (0.020x0.020inch) 0.707mm (0.028inch) 1.05to1.15mm (0.041to0.045inch) • Over-sizing the PTH can lead to twisted LED after clinching.OntheotherhandundersizingthePTHcan causedifficultyinsertingtheTHLED. AllnGaP Device CATHODE |
Аналогичный номер детали - HLMP-AD06-P0TXX |
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Аналогичное описание - HLMP-AD06-P0TXX |
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