SMBJ6.0CA datasheet(5/10 Pages) STMICROELECTRONICS

номер детали	SMBJ6.0CA

подробное описание детали	Transil

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SMBJ

Characteristics

Doc ID 5616 Rev 10

5/10

Figure 6.

Junction capacitance versus

reverse applied voltage for

unidirectional types (typical values)

Figure 7.

Junction capacitance versus

reverse applied voltage for

bidirectional types (typical values)

10

100

1000

10000

1

10

100

1000

C(pF)

F=1 MHz

V

osc=30 mVRMS

T

j=25 °C

SMBJ5.0A

SMBJ12A

SMBJ24A

SMBJ40A

SMBJ85A

SMBJ188A

VR(V)

10

100

1000

10000

1

10

100

1000

C(pF)

F=1 MHz

V

osc=30 mVRMS

T

j=25 °C

SMBJ5.0CA

SMBJ12CA

SMBJ24CA

SMBJ40CA

SMBJ85CA

SMBJ188CA

VR(V)

Figure 8.

Peak forward voltage drop

versus peak forward current

(typical values)

Figure 9.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

Figure 10. Thermal resistance, junction to

ambient, versus copper surface

under each lead

Figure 11. Leakage current versus junction

temperature (typical values)

I

FM(A)

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

T

j =25 °C

T

j =125 °C

VFM(V)

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

Z

th(j-a) /Rth(j-a)

tP(s)

Recommended pad layout

PCB FR4, copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(J-A)

SCU(cm²)

PCB FR4, copper thickness = 35 µm

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

25

50

75

100

125

150

V

R=VRM

V

RM ≥ 10 V

V

R=VRM

V

RM <10 V

Tj(°C)

I

R (nA)

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