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DM3AT-SF-PEJM5 датащи(PDF) 11 Page - Hirose Electric |
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DM3AT-SF-PEJM5 датащи(HTML) 11 Page - Hirose Electric |
11 / 11 page 11 DM3 Series ●microSD™ Card Connectors ● Refer to applicable Operation Manual listed below for additional precautions. Series DM3AT Series DM3BT Series DM3CS Series DM3D Series ETAD-F0345 ETAD-F0324 ETAD-F0335 ETAD-F0353 Operation Manual Number ■Recommended temperature profile ■Precautions 1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the ejection mechanism and electrical performance of the connector 2. Do not apply excessive force to the connector when handling or after installation on the PC board. 3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards. Follow the correct insertion / ejection procedure for the specific connector in use. Attempts of incorrect insertion of the card may cause damage to the connector or the card. 4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in the un-mounted connector. 5. Mounting on the Flexible Printed Circuit (FPC) To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under the FPC. 6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance. 7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on the connector performance. HRS test condition Solder method :Reflow, IR/hot air Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-GRN360-K2-V) Test board :Glass epoxy 60mm∞100mm∞1.0mm thick Metal mask :0.12mm thick Number of reflow cycles : 2cycles max. The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. 50 90 to 120 seconds Preheating 50 seconds Soldering Time (Seconds) (ç) 100 150 200 250 150ç 200ç 230ç min. Peak:250ç MAX The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. |
Аналогичный номер детали - DM3AT-SF-PEJM5 |
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Аналогичное описание - DM3AT-SF-PEJM5 |
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