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DM3AT-SF-PEJM5 датащи(PDF) 11 Page - Hirose Electric

номер детали DM3AT-SF-PEJM5
подробное описание детали  microSD Card Connectors
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производитель  HIROSE [Hirose Electric]
домашняя страница  http://www.hirose-connectors.com
Logo HIROSE - Hirose Electric

DM3AT-SF-PEJM5 датащи(HTML) 11 Page - Hirose Electric

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11
DM3 Series
microSD™ Card Connectors
● Refer to applicable Operation Manual listed below for additional precautions.
Series
DM3AT Series
DM3BT Series
DM3CS Series
DM3D Series
ETAD-F0345
ETAD-F0324
ETAD-F0335
ETAD-F0353
Operation Manual Number
■Recommended temperature profile
■Precautions
1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the
ejection mechanism and electrical performance of the connector
2. Do not apply excessive force to the connector when handling or after installation on the PC board.
3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards.
Follow the correct insertion / ejection procedure for the specific connector in use.
Attempts of incorrect insertion of the card may cause damage to the connector or the card.
4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in
the un-mounted connector.
5. Mounting on the Flexible Printed Circuit (FPC)
To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under
the FPC.
6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance.
7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on
the connector performance.
HRS test condition
Solder method
:Reflow, IR/hot air
Environment
:Room air
Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-GRN360-K2-V)
Test board
:Glass epoxy 60mm∞100mm∞1.0mm thick
Metal mask
:0.12mm thick
Number of reflow cycles : 2cycles max.
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
50
90 to 120 seconds
Preheating
50
seconds
Soldering
Time (Seconds)
(ç)
100
150
200
250
150ç
200ç
230ç min.
Peak:250ç MAX
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.


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