©2009 Littelfuse, Inc.

Gas Discharge Tube (GDT) Products

43

Revised: November 10, 2009

Specifications are subject to change without notice.

Please refer to www.littelfuse.com for current information.

Customer should verify actual device performance in their specific applications.

SL1003A Series

SL1003A Series

Reflow Condition

Pb-free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (Min to Max) (t

60 – 180 seconds

Average Ramp-up Rate (LiquidusTemp

(T

3°C/second max.

T

5°C/second max.

Reflow

-Temperature (T

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of Actual Peak

Temperature (t

10 – 30 seconds

Ramp-down Rate

6°C/second max.

Time 25°C to PeakTemperature (T

8 minutes max.

Do not exceed

260°C

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Time

25

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

Soldering Parameters - Wave Soldering (Thru-Hole Devices)

Soldering Parameters - Hand Soldering

Dwell Time

0

20

40

60

80

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Cooling Time

Preheat Time

Wave Parameter

Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

(Typical Industry Recommendation)

Temperature Minimum:

100

Temperature Maximum:

150

Preheat Time:

60-180 seconds

Solder PotTemperature:

280

Solder DwellTime:

2-5 seconds

Recommended Process Parameters:

Solder Iron Temperature: 350° C +/- 5°C

Heating Time: 5 seconds max.