IRF6612PbF

www.irf.com

3

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

Used double sided cooling , mounting pad.

Mounted on minimum footprint full size board with metalized

back and with small clip heatsink.

Notes:

Surface mounted on 1 in. square Cu

(still air).

Mounted to a PCB with

small clip heatsink (still air)

Mounted on minimum

footprint full size board with

metalized back and with small

clip heatsink (still air)

1E-006

1E-005

0.0001

0.001

0.01

0.1

1

10

100

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

1

10

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

τ

J

τ

J

τ

1

τ

1

τ

2

τ

2

τ

3

τ

3

R

1

R

1

R

2

R

2

R

3

R

3

Ci=

τi/Ri

Ci=

τi/Ri

τ

A

τ

A

τ

4

τ

4

R

4

R

4

Ri (°C/W)

τi (sec)

1.2801

0.000322

8.7256

0.164798

21.750

2.25760

13.251

69

Absolute Maximum Ratings

Power Dissipation

Power Dissipation

W

Power Dissipation

Peak Soldering Temperature

°C

Operating Junction and

Storage Temperature Range

Thermal Resistance

Parameter

Typ.

Max.

Units

Junction-to-Ambient

–––

45

Junction-to-Ambient

12.5

–––

Junction-to-Ambient

20

–––

°C/W

Junction-to-Case

–––

1.4

Junction-to-PCB Mounted

1.0

–––

Linear Derating Factor

W/°C

0.022

-40 to + 150

2.8

270

1.8

89