AD7804/AD7805/AD7808/AD7809

REV. A

–6–

PDIP (N-24) Package, Power Dissipation . . . . . . . . . 670 mW

θ

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260

°C

SOIC (R-28) Package, Power Dissipation . . . . . . . . . 875 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

PDIP (N-28) Package, Power Dissipation . . . . . . . . . 875 mW

θ

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260

°C

SSOP (RS-28) Package, Power Dissipation . . . . . . . . 875 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

TQFP (S

U-44) Package, Power Dissipation . . . . . .

450 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

of the package is not exceeded.

ABSOLUTE MAXIMUM RATINGS

1

AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V + 0.3 V

2

Input Current to Any Pin Except Supplies

3

. . . . . . . .

±10 mA

Operating Temperature Range

AD7804/AD7805 Commercial Plastic

(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

AD7808/AD7809 Commercial Plastic

(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

SOIC (R-16) Package, Power Dissipation . . . . . . . . . 450 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

PDIP (N-16) Package, Power Dissipation . . . . . . . . . 670 mW

θ

°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260

°C

SOIC (R-24) Package, Power Dissipation . . . . . . . . . 450 mW

θ

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

ORDERING GUIDE

Supply

Temperature

Relative

Package

Model

Voltage

Range

Accuracy

Package Descriptions

Options

AD7804BN

3.3 V to 5 V

–40

°C to +85°C

±3 LSB

16-Lead Plastic DIP

N-16

AD7804BR

3.3 V to 5 V

–40

°C to +85°C

±3 LSB

16-Lead Small Outline IC

R-16

AD7805BN

3.3 V to 5 V

–40

°C to +85°C

±3 LSB

28-Lead Plastic DIP

N-28

AD7805BR

3.3 V to 5 V

–40

°C to +85°C

±3 LSB

28 Lead Small Outline IC

R-28

AD7805BRS

3.3 V to 5 V

–40

°C to +85°C

±3 LSB

28-Lead Shrink Small Outline Package

RS-28

AD7805CR

3.3 V to 5 V

–40

°C to +85°C

±3 LSB

28-Lead Small Outline IC

R-28

AD7808BN

3.3 V to 5 V

–40

°C to +85°C

±4 LSB

24-Lead Plastic DIP

N-24

AD7808BR

3.3 V to 5 V

–40

°C to +85°C

±4 LSB

24 Lead Small Outline IC

R-24

AD7809BST

3.3 V to 5 V

–40

°C to +85°C

±4 LSB

44-Lead Thin Plastic Quad Flatpack (TQFP)

S

U-44

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although these devices feature proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE