SOT-223

DDPAK/TO-263

LM340-N, LM78xx

SNOSBT0J – FEBRUARY 2000 – REVISED DECEMBER 2013

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Figure 3. Current Regulator

Figure 4. Comparison between SOT-223 and

DDPAK/TO-263 Packages

Scale 1:1

Connection Diagrams

Figure 5. DDPAK/TO-263 Surface-Mount Package

Figure 6. 3-Lead SOT-223

Top View

Top View

See Package Number KTT0003B

See Package Number DCY

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

DC Input Voltage

35V

Internally Limited

Maximum Junction Temperature

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec.)

TO-3 Package (NDS)

300°C

TO-220 Package (NDE), DDPAK/TO-263

Package (KTT)

230°C

2 kV

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which

the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical

Characteristics.

(2)

Military datasheets are available upon request. At the time of printing, the military datasheet specifications for the LM140K-5.0/883,

LM140K-12/883, and LM140K-15/883 complied with the min and max limits for the respective versions of the LM140. The LM140H and

LM140K may also be procured as JAN devices on slash sheet JM38510/107.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(4)

The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation

temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal

resistance (

package and the case-to-ambient thermal resistance of the heatsink. For the TO-220 package (NDE),

SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heatsink (see Applications Hints on

heatsinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area

thermally connected to the package: Using 0.5 square inches of copper area,

37°C/W; and with 1.6 or more inches of copper area,

(5)

ESD rating is based on the human body model, 100 pF discharged through 1.5 k

Ω.

Operating Conditions

(1)

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which

the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical

Characteristics.

2

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