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LM2937ES-2.5 датащи(PDF) 9 Page - Texas Instruments |
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LM2937ES-2.5 датащи(HTML) 9 Page - Texas Instruments |
9 / 19 page LM2937-2.5, LM2937-3.3 www.ti.com SNVS015E – FEBRUARY 1998 – REVISED APRIL 2013 When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is less than or equal to this number. θ(H−A) is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink. HEATSINKING DDPAK/TO-263 AND SOT-223 PACKAGE PARTS Both the DDPAK/TO-263 (“KTT”) and SOT-223 (“DCY”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane. Figure 25 shows for the DDPAK/TO-263 the measured values of θ(J−A) for different copper area sizes using a typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking. Figure 25. θ(J−A) vs Copper (1 ounce) Area for the DDPAK/TO-263 Package As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of θ(J−A) for the DDPAK/TO-263 package mounted to a PCB is 32°C/W. As a design aid, Figure 26 shows the maximum allowable power dissipation compared to ambient temperature for the DDPAK/TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C). Figure 26. Maximum Power Dissipation vs TAMB for the DDPAK/TO-263 Package Figure 27 and Figure 28 show the information for the SOT-223 package. Figure 28 assumes a θ(J−A) of 74°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of +85°C. Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: LM2937-2.5 LM2937-3.3 |
Аналогичный номер детали - LM2937ES-2.5 |
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Аналогичное описание - LM2937ES-2.5 |
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