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DAC708 датащи(PDF) 3 Page - Burr-Brown (TI) |
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DAC708 датащи(HTML) 3 Page - Burr-Brown (TI) |
3 / 11 page 3 ® DAC707/708/709 PACKAGE DRAWING PRODUCT PACKAGE NUMBER(1) DAC707JP 28-Pin Plastic DBL Wide DIP 215 DAC707KP 28-Pin Plastic DBL Wide DIP 215 DAC707BH 28LD Side Brazed 149 Hermetic Dip DAC707KH 28LD Side Brazed 149 Hermetic DIP DAC707SH 28LD Side Brazed 149 Hermetic DIP DAC708BH 24LD Side Brazed 165 Hermetic DIP DAC708KH 24LD Side Brazed 165 Hermetic DIP DAC708SH 24LD Side Brazed 165 Hermetic DIP DAC709BH 24LD Side Brazed 165 Hermetic DIP DAC709KH 24LD Side Brazed 165 Hermetic DIP DAC709SH 24LD Side Brazed 165 Hermetic DIP NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. DAC707/708/709KH, DAC707/708/ DAC707JP DAC707KP 709BH, SH PRODUCT MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS At T A = +25°C, VCC = ±15V, VDD = +5V, and after a 10-minute warm-up, unless otherwise noted. ELECTRICAL (CONT) *Specification same as for models in column to the left. NOTES: (1) MSB must be inverted externally prior to DAC708/709 input. (2) Digital inputs are TTL, LSTTL, 54/74C, 54/74HC and 54/74HTC compatible over the specified temperature range. (3) DAC708 (current-output models) are specified and tested with an external output operational amplifier connected using the internal feedback resistor in all tests. (4) FSR means Full Scale Range. For example, for ±10V output, FSR = 20V. (5) ±0.0015% of Full Scale Range is equal to 1 LSB in 16-bit resolution, ±0.003% of Full Scale Range is equal to 1 LSB in 15-bit resolution. ±0.006% of Full Scale Range is equal to 1 LSB in 14-bit resolution. (6) Error at input code 0000 H. (For unipolar connection on DAC708/709, the MSB must be inverted externally prior to D/A input.) (7) Adjustable to zero with external trim potentiometer. Adjusting the gain potentiometer rotates the transfer function around the bipolar zero point. (8) With gain and zero errors adjusted to zero at +25 °C. (9) Maximum represents the 3σ limit. Not 100% tested for this parameter. (10) The bipolar worst-case code change is FFFFH to 0000H and 0000H to FFFFH. For unipolar (DAC708/709 only) it is 7FFFH to 8000H and 8000H to 7FFFH. POWER SUPPLY REQUIREMENTS Voltage (all models): +VCC +13.5 +15 +16.5 * * * * * * V –VCC –13.5 –15 –16.5 * * * * * * V VDD +4.5 +5 +5.5 * * * * * * V Current (No Load, +15V Supplies) Current Output Models: +VCC +10 +25 * * mA –VCC –13 –25 * * mA VDD +5 +10 * * mA Voltage Output Models: +VCC +16 +30 * * * * mA –VCC –18 –30 * * * * mA VDD +5 +10 * * * * mA Power Dissipation ( ±15V supplies) Current Output Models 370 800 * * mW Voltage Output Models 535 * 950 * * mW TEMPERATURE RANGE Specification: BH Grades –25 +85 °C JP, KP, KH Grades 0 +70 * * °C SH Grades –55 +125 °C Storage: Ceramic –65 +150 –65 +150 °C Plastic –60 +100 * * °C PACKAGE INFORMATION ABSOLUTE MAXIMUM RATINGS VDD to COMMON ........................................................................ 0V, +15V +VCC to COMMON ..................................................................... 0V, +18V –VCC to COMMON ...................................................................... 0V, –18V Digital Data Inputs to COMMON ..................................... –0.5V, VDD +0.5 DC Current any input ..................................................................... ±10mA Reference Out to COMMON ...................... Indefinite Short to COMMON VOUT (DAC707, DAC709) ........................... Indefinite Short to COMMON External Voltage Applied to RF (pin 13 or 14, DAC708) .................. ±18V External Voltage Applied to D/A Output (pin 1, DAC707; pin 14, DAC709) ......................................................... ±5V Power Dissipation ........................................................................ 1000mW Storage Temperature ..................................................... –60 °C to +150°C Lead Temperature (soldering, 10s) ................................................. 300 °C Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
Аналогичный номер детали - DAC708 |
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Аналогичное описание - DAC708 |
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