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Micron Technology, Inc., reserves the right to change products or specifications without notice.

DDF36C128_256x72.fm - Rev. G 9/08 EN

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©2002 Micron Technology, Inc. All rights reserved.

1GB, 2GB (x72, ECC, DR) 184-Pin DDR SDRAM RDIMM

Electrical Specifications

DRAM Operating Conditions

Recommended AC operating conditions are given in the DDR component data sheets.

Component specifications are available on Micron’s Web site. Module speed grades

correlate with component speed grades, as shown in table 8.

Design Considerations

Simulations

Micron memory modules are designed to optimize signal integrity through carefully

designed terminations, controlled board impedances, routing topologies, trace length

matching, and decoupling. However, good signal integrity starts at the system level.

Micron encourages designers to simulate the signal characteristics of the system’s

memory bus to ensure adequate signal integrity of the entire memory system.

Power

Operating voltages are specified at the DRAM, not at the edge connector of the module.

Designers must account for any system voltage drops at anticipated power levels to

ensure the required supply voltage is maintained.

Table 8:

Module and Component Speed Grades

DDR components may exceed the listed module speed grades

Module Speed Grade

Component Speed Grade

-40B

-5B

-335

-6

-262

-75E

-26A

-75Z

-265

-75