SL22 AND SL24

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECDO-214AC

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.0015 ounce, 0.05 gram

(V)

(V)

(V)

(V)

(

SL22

SL22

20

14

20

0.38

SL24

SL24

40

28

40

0.40

SYMBOLS

MARKING

CODE

-55 to +125

Operating

temperature

*1

*2

*3

*4

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.2

2.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

50

A

25

1.0

mA

10

mA

Thermal resistance

Junction to ambient

R

70

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

160

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Silicon epitaxial planer type

0.185(4.8)

0.177(4.4)

0.012(0.3) Typ.

0.110(2.8)

0.094(2.4)

0.165(4.2)

0.150(3.8)

0.067(1.7)

0.060(1.5)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMA

Formosa MS

Low VF Chip Schottky Barrier Diodes