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DAC3484 датащи(PDF) 10 Page - Texas Instruments

номер детали DAC3484
подробное описание детали  Quad-Channel, 16-Bit, 1.25 GSPS Digital-to-Analog Converter (DAC)
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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DAC3484 датащи(HTML) 10 Page - Texas Instruments

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DAC3484
SLAS749C – MARCH 2011 – REVISED AUGUST 2012
www.ti.com
THERMAL INFORMATION
DAC3484
RKD
ZAY
THERMAL METRIC(1)
UNITS
PACKAGE
PACKAGE
88 PINS
196 BALL
θJA
Junction-to-ambient thermal resistance(2)
22.1
37.6
θJCtop
Junction-to-case (top) thermal resistance(3)
7.1
6.8
θJCbot
Junction-to-case (bottom) thermal resistance(4)
0.6
N/A
°C/W
θJB
Junction-to-board thermal resistance(5)
4.7
16.8
ψJT
Junction-to-top characterization parameter(6)
0.1
0.2
ψJB
Junction-to-board characterization parameter(7)
4.6
16.4
spacer
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
(5)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(6)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
Recommended operating junction temperature
105
TJ
°C
Maximum rated operating junction temperature(1)
125
TA
Recommended free-air temperature
–40
25
85
°C
(1)
Prolonged use at this junction temperature may increase the d evice failure-in-time (FIT) rate.
10
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