поискавой системы для электроныых деталей |
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TPS22920 датащи(PDF) 2 Page - Texas Instruments |
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TPS22920 датащи(HTML) 2 Page - Texas Instruments |
2 / 21 page D D C C B B A A 2 1 1 2 LAZER MARKING VIEW BUMP VIEW YZP PACKAGE TPS22920 SLVSAY8A – JUNE 2011 – REVISED JULY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Figure 2. Bump Assignments Bump Assignments (YZP Package) D GND ON C VOUT VIN B VOUT VIN A VOUT VIN 1 2 Pin Description TPS22920 PIN NAME DESCRIPTION YZP D1 GND Ground D2 ON Switch control input, active high. Do not leave floating A1, B1, C1 VOUT Switch output A2, B2, C2 VIN Switch input, bypass this input with a ceramic capacitor to ground 2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: TPS22920 |
Аналогичный номер детали - TPS22920_14 |
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Аналогичное описание - TPS22920_14 |
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