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LC0408FC3.3C датащи(PDF) 1 Page - Protek Devices |
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LC0408FC3.3C датащи(HTML) 1 Page - Protek Devices |
1 / 9 page Only One Name Means ProTek’Tion™ www.protekdevices.com 05153.R9 9/12 Page 1 LC0408FC3.3C - LC0408FC36C 200w Low CaPaCitanCe FLiP ChiP tvs aRRay DesCRiPtion The LC0408FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis- charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require- ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In ad- dition, the LC0408FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. FeatuRes • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • ESD Protection > 25 kilovolts • Available in Voltages Ranging from 3.3V to 36V • 200 Watts Peak Pulse Power per Line (tp = 8/20µs) • Protection for 4 to 7 Lines • Bidirectional and Monolithic Structure • Low Clamping Voltage • Low Capacitance • RoHS Compliant • REACH Compliant MeChaniCaL ChaRaCteRistiCs • Standard EIA Chip Size: 0408 • Approximate Weight: 0.73 milligrams • Lead-Free Plating • Solder Reflow Temperature: • Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C • Flammability Rating UL 94V-0 • 8mm Tape per EIA Standard 481 • Top Contacts: Solder Bump 0.004” in Height (Nominal) aPPLiCations • Cellular Phones • MCM Boards • Wireless Communication Circuits • IR LEDs • SMART & PCMCIA Cards Pin ConFiGuRation |
Аналогичный номер детали - LC0408FC3.3C_12 |
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Аналогичное описание - LC0408FC3.3C_12 |
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