поискавой системы для электроныых деталей |
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SDA-3000SB датащи(PDF) 6 Page - RF Micro Devices |
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SDA-3000SB датащи(HTML) 6 Page - RF Micro Devices |
6 / 7 page RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421 DS140204 For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com. The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. 6 of 7 SDA-3000 Pin Names and Descriptions Pin Name Description Interface Schematic 1 RFIN RF Input. This pad is DC coupled and matched to 50 Ω from DC to 24GHz. 50 Ω microstrip transmission line on 0.127mm (5mil) thick alumina thin film substrate is recommended for RF input and output. 2 VG2 VG2 is an optional pad. It may be used to bias the cascode gate of the amplifier. If this port is used, a 1000pF bypass capacitor with the shortest wirebond length possible is recommended to prevent low frequency gain ripple. 3 VTO The output drain termination pad. This pad requires a suggested 1000pF bypass capacitor with the shortest wirebond length to prevent low frequency gain ripple. The value of the external capacitance limits the low frequency response of the amplifier. 4 RFOUT and VDD RF Output. 50 Ω microstrip transmission line on 0.127mm (5mil) thick alumina thin film substrate is recommended for RF input and output. Connect the DC bias (VDD) network to provide drain current (IDD). 5 VCAS Provides VG2 gate voltage to the cascode amplifier. The value is ~ (VCC/2 – absolute value of VTI). 6 VG21 Not connected. 7 VTI Input gate voltage, used to bias the amplifier. The value is between -1.5VDC (device is pinched OFF) to +0.2VDC (fully ON). This pad requires a bypass capacitor to ground with the shortest possible wirebond length to prevent low frequency gain ripple. The value of the external capacitance limits the low frequency response of the amplifier. Die GND Ground connection. Connect die bottom directly to ground plane for best performance. NOTE: The die should be connected directly to the ground plane with conductive epoxy. |
Аналогичный номер детали - SDA-3000SB |
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Аналогичное описание - SDA-3000SB |
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