RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140204

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

6 of 7

SDA-3000

Pin Names and Descriptions

Pin

Name

Description

Interface Schematic

1

RFIN

RF Input. This pad is DC coupled and matched to 50

Ω from DC to

24GHz. 50

Ω microstrip transmission line on 0.127mm (5mil) thick

alumina thin film substrate is recommended for RF input and

output.

2

VG2

VG2 is an optional pad. It may be used to bias the cascode gate of

the amplifier. If this port is used, a 1000pF bypass capacitor with

the shortest wirebond length possible is recommended to prevent

low frequency gain ripple.

3

VTO

The output drain termination pad. This pad requires a suggested

1000pF bypass capacitor with the shortest wirebond length to

prevent low frequency gain ripple. The value of the external

capacitance limits the low frequency response of the amplifier.

4

RFOUT and

VDD

RF Output. 50

Ω microstrip transmission line on 0.127mm (5mil)

thick alumina thin film substrate is recommended for RF input and

5

VCAS

Provides VG2 gate voltage to the cascode amplifier. The value is

6

VG21

Not connected.

7

VTI

Input gate voltage, used to bias the amplifier. The value is between

requires a bypass capacitor to ground with the shortest possible

wirebond length to prevent low frequency gain ripple. The value of

the external capacitance limits the low frequency response of the

amplifier.

Die

GND

Ground connection. Connect die bottom directly to ground plane for

best performance. NOTE: The die should be connected directly to

the ground plane with conductive epoxy.