TPA6166A2

SLAS997B – MARCH 2014 – REVISED JANUARY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply voltage, VDD

–0.3

2

V

Microphone supply voltage, MICVDD

–0.3

3.9

V

Output continuous total power dissipation

See Thermal Information

–65

85

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VDD

Supply voltage

1.7

1.9

V

MICVDD

Microphone supply voltage

2.4

3.6

V

Operating temperature

–25

85

°C

470

pF

Maximum load

470

capacitance

specified by design

200

Operating junction temperature

–25

150

°C

6.4 Thermal Information

TPA6166A2

YFF (WSCP)

UNIT

25 PINS

Junction-to-ambient thermal resistance

67

Junction-to-case (top) thermal resistance

18

Junction-to-board thermal resistance

38

°C/W

Junction-to-top characterization parameter

0.1

Junction-to-board characterization parameter

36

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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