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LM3212 датащи(PDF) 3 Page - Texas Instruments

номер детали LM3212
подробное описание детали  LM3212 Step-Down DC-DC Converter with Analog Bypass Mode for RF Power Amplifiers
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
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LM3212 датащи(HTML) 3 Page - Texas Instruments

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LM3212
www.ti.com
SNOSB37C – DECEMBER 2008 – REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS
(1) (2) (3)
VDD, PVIN to SGND
−0.2V to +6.0V
PGND to SGND
−0.2V to +0.2V
EN, FB, VCON, AUTO_BY
(SGND
−0.2V)
to (VDD +0.2V)
w/6.0V max
SW, ACB
(PGND
−0.2V)
to (PVIN +0.2V)
w/6.0V max
PVIN to VDD
−0.2V to +0.2V
Continuous Power Dissipation(4)
Internally Limited
Junction Temperature (TJ-MAX)
+150°C
Storage Temperature Range
−65°C to +150°C
Maximum Lead Temperature
+260°C
(Soldering, 10 sec)
ESD Rating(5)(6)
Human Body Model
2 kV
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential at the GND pins. The LM3212 is designed for mobile phone applications where turn-on after
power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal
Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds
2.7V.
(3)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and
disengages at TJ = 125°C (typ.).
(5)
The Human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. (MIL-STD-883 3015.7) The machine
model is a 200 pF capacitor discharged directly into each pin.
(6)
Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD
handling procedures can result in damage.
OPERATING RATINGS
(1) (2)
Input Voltage Range
2.7V to 5.5V
Recommended Load Current
0A to 2.5A
Junction Temperature (TJ) Range
−30°C to +125°C
Ambient Temperature (TA) Range
(3)
−30°C to +85°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2)
All voltages are with respect to the potential at the GND pins. The LM3212 is designed for mobile phone applications where turn-on after
power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal
Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds
2.7V.
(3)
In applications where high-power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). At higher power levels duty
cycle usage is assumed to drop (i.e., max power 12.5% usage is assumed) for GS/GPRS mode.
THERMAL PROPERTIES
PARAMETER
UNIT
Junction-to-Ambient Thermal
50°C/W
Resistance (
θJA), YZR Package
(1)
(1)
Junction-to-ambient thermal resistance (
θJA) is taken from thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7.
Copyright © 2008–2013, Texas Instruments Incorporated
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