поискавой системы для электроныых деталей |
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TPS50601-DIE датащи(PDF) 3 Page - Texas Instruments |
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TPS50601-DIE датащи(HTML) 3 Page - Texas Instruments |
3 / 7 page TPS50601-DIE www.ti.com SLVSC37A – JUNE 2013 – REVISED JUNE 2014 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5 Bare Die Information BACKSIDE BOND PAD BOND PAD DIE THICKNESS BACKSIDE FINISH POTENTIAL METALLIZATION COMPOSITION THICKNESS 15 mils. Silicon with backgrind Floating Al5TiN 557.5 nm Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 |
Аналогичный номер детали - TPS50601-DIE_15 |
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Аналогичное описание - TPS50601-DIE_15 |
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