TMP302

SBOS488C – JUNE 2009 – REVISED AUGUST 2015

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Table of Contents

7.3

Feature Description................................................... 9

1

Features .................................................................. 1

7.4

Device Functional Modes.......................................... 9

2

Applications ........................................................... 1

8

Application and Implementation ........................ 10

3

Description ............................................................. 1

8.1

Application Information............................................ 10

4

Revision History..................................................... 2

8.2

Typical Application ................................................. 10

5

Pin Configuration and Functions ......................... 3

9

Power Supply Recommendations ...................... 13

6

Specifications......................................................... 4

10

Layout................................................................... 13

6.1

Absolute Maximum Ratings ...................................... 4

10.1

Layout Guidelines ................................................. 13

6.2

ESD Ratings.............................................................. 4

10.2

Layout Example .................................................... 13

6.3

Recommended Operating Conditions ....................... 4

11

Device and Documentation Support ................. 14

6.4

Thermal Information .................................................. 4

11.1

Community Resources.......................................... 14

6.5

Electrical Characteristics........................................... 5

11.2

Trademarks ........................................................... 14

6.6

Typical Characteristics .............................................. 6

11.3

Electrostatic Discharge Caution ............................ 14

7

Detailed Description .............................................. 8

11.4

Glossary ................................................................ 14

7.1

Overview ................................................................... 8

12

Mechanical, Packaging, and Orderable

7.2

Functional Block Diagram ......................................... 8

Information ........................................................... 14

4 Revision History

Changes from Revision B (December 2014) to Revision C

Page

•

Changed device names by simplifying from TMP302A, TMP302B, TMP302C, and TMP302D to TMP302 ......................... 1

•

Added plus-minus symbol to Machine Model value in ESD Ratings table............................................................................. 4

•

Moved Specified Operating Temperature parameter from Electrical Characteristics table to Recommended

Operating Conditions table ..................................................................................................................................................... 4

•

Added Community Resources section ................................................................................................................................. 14

Changes from Revision A (September 2009) to Revision B

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 4

2

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