поискавой системы для электроныых деталей |
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TMP75CIDGKR датащи(PDF) 4 Page - Texas Instruments |
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TMP75CIDGKR датащи(HTML) 4 Page - Texas Instruments |
4 / 31 page TMP75C SBOS707B – APRIL 2014 – REVISED AUGUST 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VS 4 V SDA, SCL, ALERT, A2, A1 -0.3 4 V Input voltage A0 -0.3 (VS) + 0.3 V Sink current SDA, ALERT 10 mA Operating junction temperature -55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range -60 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 Electrostatic V(ESD) V discharge Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –1000 1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage 1.4 1.8 3.6 V Operating free-air temperature, TA -55 125 °C 6.4 Thermal Information TMP75C THERMAL METRIC(1) D (SOIC) DGK (VSSOP) UNIT 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 125.4 188.1 RθJC(top) Junction-to-case (top) thermal resistance 71.5 79.1 RθJB Junction-to-board thermal resistance 65.8 109.6 °C/W ψJT Junction-to-top characterization parameter 21.1 15.3 ψJB Junction-to-board characterization parameter 65.3 108 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TMP75C |
Аналогичный номер детали - TMP75CIDGKR |
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Аналогичное описание - TMP75CIDGKR |
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