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TL331QDBVRQ1 датащи(PDF) 3 Page - Texas Instruments

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номер детали TL331QDBVRQ1
подробное описание детали  SINGLE DIFFERENTIAL COMPARATOR
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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TL331-Q1
www.ti.com
SLVS969C – OCTOBER 2009 – REVISED AUGUST 2013
THERMAL INFORMATION
TL331-Q1
THERMAL METRIC(1)
DBV
UNIT
5 PINS
θJA
Junction-to-ambient thermal resistance(2)
218.3
°C/W
θJCtop
Junction-to-case (top) thermal resistance(3)
87.3
°C/W
θJB
Junction-to-board thermal resistance(4)
44.9
°C/W
ψJT
Junction-to-top characterization parameter(5)
4.3
°C/W
ψJB
Junction-to-board characterization parameter(6)
44.1
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance(7)
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
ELECTRICAL CHARACTERISTICS
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
TA
MIN
TYP
MAX
UNIT
25°C
2
5
VCC = 5 V to 30 V, VO = 1.4 V,
VIO
Input offset voltage
mV
VIC = VIC(min)
–40°C to 125°C
9
25°C
5
50
IIO
Input offset current
VO = 1.4 V
nA
–40°C to 125°C
250
25°C
–25
–250
IIB
Input bias current
VO = 1.4 V
nA
–40°C to 125°C
–400
25°C
0 to VCC – 1.5
Common-mode input voltage
VICR
V
range(2)
–40°C to 125°C
0 to VCC – 2
Large-signal differential-voltage
VCC = 15 V, VO = 1.4 V to 11.4 V,
AVD
25°C
50
200
V/mV
amplification
RL ≥ 15 kΩ to VCC
VOH = 5 V, VID = 1 V
25°C
0.1
50
nA
IOH
High-level output current
VOH = 30 V, VID = 1 V
–40°C to 125°C
1
μA
25°C
150
400
VOL
Low-level output voltage
IOL = 4 mA, VID = –1 V
mV
–40°C to 125°C
700
IOL
Low-level output current
VOL = 1.5 V, VID = –1 V
25°C
6
mA
ICC
Supply current
RL = ∞, VCC = 5 V
25°C
0.4
0.7
mA
(1)
All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2)
The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-
mode voltage range is VCC+ – 1.5 V at 25ºC, but either or both inputs can go to 30 V without damage.
SWITCHING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
UNIT
100-mV input step with 5-mV overdrive
1.3
Response time
RL connected to 5 V through 5.1 kΩ, CL = 15 pF
(1) (2)
μs
TTL-level input step
0.3
(1)
CL includes probe and jig capacitance.
(2)
The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
Copyright © 2009–2013, Texas Instruments Incorporated
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