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SI535 датащи(PDF) 5 Page - Silicon Laboratories |
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SI535 датащи(HTML) 5 Page - Silicon Laboratories |
5 / 12 page Si535/536 Rev. 1.1 5 Table 6. Environmental Compliance The Si535/536 meets the following qualification test requirements. Parameter Conditions/Test Method Mechanical Shock MIL-STD-883, Method 2002 Mechanical Vibration MIL-STD-883, Method 2007 Solderability MIL-STD-883, Method 2003 Gross & Fine Leak MIL-STD-883, Method 1014 Resistance to Solder Heat MIL-STD-883, Method 2036 Moisture Sensitivity Level J-STD-020, MSL1 Contact Pads Gold over Nickel Table 7. Thermal Characteristics (Typical values TA = 25 ºC, VDD =3.3 V) Parameter Symbol Test Condition Min Typ Max Unit Thermal Resistance Junction to Ambient JA Still Air — 84.6 — °C/W Thermal Resistance Junction to Case JC Still Air — 38.8 — °C/W Ambient Temperature TA –40 — 85 °C Junction Temperature TJ —— 125 °C Table 8. Absolute Maximum Ratings1 Parameter Symbol Rating Unit Maximum Operating Temperature TAMAX 85 °C Supply Voltage, 2.5/3.3 V Option VDD –0.5 to +3.8 V Input Voltage (any input pin) VI –0.5 to VDD + 0.3 V Storage Temperature TS –55 to +125 °C ESD Sensitivity (HBM, per JESD22-A114) ESD 2500 V Soldering Temperature (Pb-free profile)2 TPEAK 260 °C Soldering Temperature Time @ TPEAK (Pb-free profile) 2 tP 20–40 seconds Notes: 1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended periods may affect device reliability. 2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at www.silabs.com/VCXO for further information, including soldering profiles. |
Аналогичный номер детали - SI535 |
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Аналогичное описание - SI535 |
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