TPIC6C595

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SLIS061D – JULY 1998 – REVISED SEPTEMBER 2015

6.4 Thermal Information

TPIC6C595

D (SOIC)

N (PDIP)

PW (TSSOP)

UNIT

16 PINS

16 PINS

16 PINS

Junction-to-ambient thermal resistance

82.3

51.5

109.7

°C/W

Junction-to-case (top) thermal resistance

39.7

31.4

44.6

°C/W

Junction-to-board thermal resistance

41.4

38.8

54.8

°C/W

Junction-to-top characterization parameter

11.3

23.6

5

°C/W

Junction-to-board characterization parameter

39.5

31.3

54.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Drain-to-source breakdown

33

37

V

voltage

Source-to-drain diode forward

0.85

1.2

V

voltage

4.4

4.49

High-level output voltage, SER

V

OUT

4

4.2

0.005

0.1

Low-level output voltage, SER

V

OUT

0.3

0.5

High-level input current

1

µA

Low-level input current

–1

µA

All outputs off

20

200

Logic supply current

µA

All outputs on

150

500

Logic supply current at

1.2

5

mA

frequency

All outputs off,

See Figure 9 and Figure 2

Nominal current

90

mA

0.1

0.2

Off-state drain current

µA

0.15

0.3

6.5

9

Static drain-source on-state

9.9

12

Ω

resistance

and Figure 4

6.8

10

(1)

(2)

These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts.

(3)

Nominal current is defined for a consistent comparison between devices from different sources. It is the current that produces a voltage

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