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LM3691 датащи(PDF) 5 Page - Texas Instruments |
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LM3691 датащи(HTML) 5 Page - Texas Instruments |
5 / 29 page LM3691 www.ti.com SNVS506J – MAY 2008 – REVISED DECEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN pin to GND −0.2 6 V EN, MODE, FB, SW pins (GND − 0.2) VIN + 0.2 V Junction temperature (TJ-MAX) 150 °C Continuous power dissipation(3) Internally Limited Maximum lead temperature (soldering, 10 seconds) 260 °C Storage temperature, Tstg 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and disengages at TJ = 130°C (typical). 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Machine model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input voltage 2.3 5.5 V Recommended load current 0 1000 mA Junction temperature, TJ −30 125 °C Ambient temperature, TA (1) −30 85 °C (1) In applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package (RθJA) in the application, as given by the following equation: TA-MAX = TJ-MAX − (RθJA × PD-MAX). Due to the pulsed nature of testing the part, the temp in Electrical Characteristics is specified as TA = TJ. 7.4 Thermal Information LM3691 THERMAL METRIC(1) YZR (DSBGA) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance(2) 85 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Junction-to-ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care must be given to thermal dissipation issues in board design. Copyright © 2008–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM3691 |
Аналогичный номер детали - LM3691_15 |
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Аналогичное описание - LM3691_15 |
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