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TLP176G датащи(PDF) 2 Page - Toshiba Semiconductor

номер детали TLP176G
подробное описание детали  Modems In PC Modem?묯ax Cards Telecommunications
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP176G датащи(HTML) 2 Page - Toshiba Semiconductor

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TLP176G
2014-09-22
2
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
IF
50
mA
Forward current derating (Ta ≥ 25°C)
∆IF / °C
−0.5
mA / °C
Pulse forward current (100μs pulse,100pps)
IFP
1
A
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Off
−state output terminal voltage
VOFF
350
V
On
−state current
ION
120
mA
On
−state current derating (Ta ≥ 25°C)
∆lON / °C
−1.2
mA / °C
Junction temperature
Tj
125
°C
Total power dissipation
PT
350
mW
Total power dissipation derating(Ta ≥ 25°C)
∆PT / °C
−0.35
mW / °C
Storage temperature range
Tstg
−55 to 125
°C
Operating temperature range
Topr
−40 to 85
°C
Lead soldering temperature(10 s)
Tsol
260
°C
Isolation voltage (AC,1 minute, R.H.≤ 60%)(Note 1)
BVS
1500
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1): Device considered a two
−terminal device: Pin 1 and 2 shorted together and pin 3 and 4 shorted together.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
Supply voltage
VDD
280
V
Forward current
IF
5
7.5
25
mA
On
−state current
ION
100
mA
Operating temperature
Topr
−20
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.


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