4

TPA6139A2

SLOS700C – JANUARY 2011 – REVISED APRIL 2016

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Copyright © 2011–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD to GND

–0.3

4

V

VSS – 0.3

VDD + 0.3

V

MUTE to GND

–0.3

VDD + 0.3

V

–40

150

°C

Lead temperature

260

°C

–40

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

TPA6139A2 IN PW PACKAGE

Electrostatic

discharge

Human-body model (HBM), per

All pins except 2 and 13

±4000

V

Pins 2 and 13

±8000

±1500

TPA6139A2 IN RGT PACKAGE

Electrostatic

discharge

Human-body model (HBM), per

All pins except 1 and 12

±4000

V

Pins 1 and 12

±8000

±1500

7.3 Recommended Operating Conditions

over operating free-air temperature range unless otherwise noted

MIN

NOM

MAX

UNIT

VDD

Supply voltage

DC supply voltage

3

3.3

3.6

V

Load resistance

16

32

10000

Ω

Low-level input voltage

MUTE

38

40

43

%PVDD

High-level input voltage

MUTE

57

60

66

%PVDD

Free-air temperature

–40

25

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

TPA6139A2

UNIT

PW (TSSOP)

RGT (VQFN)

14 PINS

16 PINS

Junction-to-ambient thermal resistance

130

52

°C/W

Junction-to-case (top) thermal resistance

49

71

°C/W

Junction-to-board thermal resistance

63

26

°C/W

Junction-to-top characterization parameter

3.6

3

°C/W

Junction-to-board characterization parameter

62

26

°C/W

Junction-to-case (bottom) thermal resistance

—

9.8

°C/W