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STZ8042 датащи(PDF) 5 Page - Solid State Optronic |
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STZ8042 датащи(HTML) 5 Page - Solid State Optronic |
5 / 9 page © 2016 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4400 Page 5 of 9 STZ8042 H/S/TR Rev 2.00 (02/29/2016) 003109 STZ8042 Zero Cross 400V / 0.8A AC Solid State Relay Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s STZ8042 Solder Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 1 |
Аналогичный номер детали - STZ8042 |
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Аналогичное описание - STZ8042 |
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