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LM2598 датащи(PDF) 4 Page - Texas Instruments

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номер детали LM2598
подробное описание детали  SIMPLE SWITCHER Power Converter 150-kHz 1-A Step-Down Voltage Regulator, With Features
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LM2598
SNVS125D – MARCH 1998 – REVISED MAY 2016
www.ti.com
Product Folder Links: LM2598
Submit Documentation Feedback
Copyright © 1998–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
Voltage internally clamped. If clamp voltage is exceeded, limit current to a maximum of 1 mA.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Maximum supply voltage, VIN
45
V
SD/SS pin input voltage(3)
6
V
Delay pin voltage(3)
1.5
V
Flag pin voltage
–0.3
45
V
Feedback pin voltage
–0.3
25
V
Output voltage to ground (steady state)
–1
V
Power dissipation
Internally limited
Lead temperature
KTW package
Vapor phase (60 s)
215
°C
Infrared (10 s)
245
NDZ package (soldering, 10 s)
260
Maximum junction temperature
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
The human body model is a 100-pF capacitor discharged through a 1.5k resistor into each pin.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)
±2000
V
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
Supply voltage
4.5
40
V
Temperature
–25
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
The package thermal impedance is calculated in accordance to JESD 51-7.
(3)
Thermal Resistances were simulated on a 4 -layer, JEDEC board.
(4)
Junction to ambient thermal resistance (no external heat sink) for the package mounted TO-220 package mounted vertically, with the
leads soldered to a printed circuit board with (1 oz.) copper area of approximately 1 in2.
(5)
Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 0.5 in2 of (1
oz.) copper area.
(6)
Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 2.5 in2 of (1
oz.) copper area.
(7)
Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit board with 3 in2 of (1 oz.)
copper area on the LM2598S side of the board, and approximately 16 in2 of copper on the other side of the PCB.
7.4 Thermal Information
THERMAL METRIC(1)
LM2598
UNIT
KTW (TO-263)
NDZ (TO-220)
7 PINS
7 PINS
RθJA
Junction-to-ambient thermal resistance(2)(3)
See(4)
50
°C/W
See(5)
50
See(6)
30
See(7)
20
RθJC(top)
Junction-to-case (top) thermal resistance
2
2
°C/W


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