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LM2598 датащи(PDF) 4 Page - Texas Instruments |
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LM2598 датащи(HTML) 4 Page - Texas Instruments |
4 / 47 page 4 LM2598 SNVS125D – MARCH 1998 – REVISED MAY 2016 www.ti.com Product Folder Links: LM2598 Submit Documentation Feedback Copyright © 1998–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Voltage internally clamped. If clamp voltage is exceeded, limit current to a maximum of 1 mA. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Maximum supply voltage, VIN 45 V SD/SS pin input voltage(3) 6 V Delay pin voltage(3) 1.5 V Flag pin voltage –0.3 45 V Feedback pin voltage –0.3 25 V Output voltage to ground (steady state) –1 V Power dissipation Internally limited Lead temperature KTW package Vapor phase (60 s) 215 °C Infrared (10 s) 245 NDZ package (soldering, 10 s) 260 Maximum junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) The human body model is a 100-pF capacitor discharged through a 1.5k resistor into each pin. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V 7.3 Recommended Operating Conditions MIN MAX UNIT Supply voltage 4.5 40 V Temperature –25 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The package thermal impedance is calculated in accordance to JESD 51-7. (3) Thermal Resistances were simulated on a 4 -layer, JEDEC board. (4) Junction to ambient thermal resistance (no external heat sink) for the package mounted TO-220 package mounted vertically, with the leads soldered to a printed circuit board with (1 oz.) copper area of approximately 1 in2. (5) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 0.5 in2 of (1 oz.) copper area. (6) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 2.5 in2 of (1 oz.) copper area. (7) Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit board with 3 in2 of (1 oz.) copper area on the LM2598S side of the board, and approximately 16 in2 of copper on the other side of the PCB. 7.4 Thermal Information THERMAL METRIC(1) LM2598 UNIT KTW (TO-263) NDZ (TO-220) 7 PINS 7 PINS RθJA Junction-to-ambient thermal resistance(2)(3) See(4) — 50 °C/W See(5) 50 — See(6) 30 — See(7) 20 — RθJC(top) Junction-to-case (top) thermal resistance 2 2 °C/W |
Аналогичный номер детали - LM2598 |
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Аналогичное описание - LM2598 |
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