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LM2941C датащи(PDF) 4 Page - Texas Instruments |
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LM2941C датащи(HTML) 4 Page - Texas Instruments |
4 / 30 page LM2941, LM2941C SNVS770I – JUNE 1999 – REVISED JANUARY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT LM2941T, LM2941S, LM2941LD 60 V Input voltage (Survival Voltage, ≤ 100 ms) LM2941CT, LM2941CS 45 V Internal power dissipation (3) Internally Limited Maximum junction temperature 150 °C TO-220 (T), Wave, 10 s 260 °C Soldering remperature(4) TO-263 (S), 30 s 235 °C WSON-8 (LD), 30 s 235 °C Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) The maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA)/RθJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the package. The value RθJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. (4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperature and time are for Sn-Pb (STD) only. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN MAX UNIT LM2941T −40 125 LM2941CT 0 125 Temperatures LM2941S −40 125 °C LM2941CS 0 125 LM2941LD −40 125 4 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C |
Аналогичный номер детали - LM2941C |
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Аналогичное описание - LM2941C |
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