поискавой системы для электроныых деталей |
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LM4040CIM3X-5.0 датащи(PDF) 5 Page - Texas Instruments |
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LM4040CIM3X-5.0 датащи(HTML) 5 Page - Texas Instruments |
5 / 67 page 5 LM4040-N, LM4040-N-Q1 www.ti.com SNOS633K – OCTOBER 2000 – REVISED JUNE 2016 Product Folder Links: LM4040-N LM4040-N-Q1 Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4040-N, TJmax = 125°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package, and 180°C/W with 0.4 ″ lead length and 170°C/W with 0.125″ lead length for the TO-92 package and 415°C/W for the SC70 Package. (4) For definitions of Peak Reflow Temperatures for Surface Mount devices, see the TI Absolute Maximum Ratings for Soldering Application Report (SNOA549). 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Reverse current 20 mA Forward current 10 mA Power dissipation (TA = 25°C)(3) SOT-23 (M3) package 306 mW TO-92 (Z) package 550 mW SC70 (M7) package 241 mW Soldering temperature(4) SOT-23 (M3) Package Peak Reflow (30 sec) 260 °C TO-92 (Z) Package Soldering (10 sec) 260 °C SC70 (M7) Package Peak Reflow (30 sec) 260 °C Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±200 |
Аналогичный номер детали - LM4040CIM3X-5.0 |
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Аналогичное описание - LM4040CIM3X-5.0 |
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