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TPS22993 датащи(PDF) 5 Page - Texas Instruments |
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TPS22993 датащи(HTML) 5 Page - Texas Instruments |
5 / 38 page TPS22993 www.ti.com SLVSCA3A – NOVEMBER 2013 – REVISED MARCH 2014 7.2 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT(2) MIN MAX VINx Input voltage for VIN1, VIN2, VIN3, VIN4 –0.3 4 V VBIAS Supply voltage for VBIAS –0.3 20 V VOUTx Output voltage for VOUT1, VOUT2, VOUT3, VOUT4 –0.3 4 V VDD, VSCL, Input voltage for VDD, SCL, SDA, ADD1, ADD2, ADD3 –0.3 4 V VSDA, VADDx VONx Input voltage for ON1, ON2, ON3, ON4 –0.3 6 V IMAX Maximum continuous switch current per channel 1.2 A TA Operating free-air temperature(3) –40 85 °C TJ Maximum junction temperature 125 125 °C TLEAD Maximum lead temperature (10-s soldering time) 300 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)) 7.3 Handling Ratings MIN MAX UNIT Tstg Storage temperature –65 150 °C Human-Body Model (HBM)(2) 2000 V ESD(1) Electrostatic discharge protection Charged-Device Model (CDM)(3) 500 V (1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device. (2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. 7.4 Thermal Information TPS22993 THERMAL METRIC(1)(2) UNIT RLW (20 TERMINALS) ΘJA Junction-to-ambient thermal resistance 58 ΘJC(top) Junction-to-case(top) thermal resistance 24 ΘJB Junction-to-board thermal resistance 10 °C/W ΨJT Junction-to-top characterization parameter 0.7 ΨJB Junction-to-board characterization parameter 10 ΘJC(bottom) Junction-to-case(bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS22993 |
Аналогичный номер детали - TPS22993_16 |
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Аналогичное описание - TPS22993_16 |
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