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TPS22993 датащи(PDF) 5 Page - Texas Instruments

номер детали TPS22993
подробное описание детали  Quad Channel Load Switch with GPIO and I2C Control
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI1 - Texas Instruments

TPS22993 датащи(HTML) 5 Page - Texas Instruments

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TPS22993
www.ti.com
SLVSCA3A – NOVEMBER 2013 – REVISED MARCH 2014
7.2 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT(2)
MIN
MAX
VINx
Input voltage for VIN1, VIN2, VIN3, VIN4
–0.3
4
V
VBIAS
Supply voltage for VBIAS
–0.3
20
V
VOUTx
Output voltage for VOUT1, VOUT2, VOUT3, VOUT4
–0.3
4
V
VDD, VSCL,
Input voltage for VDD, SCL, SDA, ADD1, ADD2, ADD3
–0.3
4
V
VSDA, VADDx
VONx
Input voltage for ON1, ON2, ON3, ON4
–0.3
6
V
IMAX
Maximum continuous switch current per channel
1.2
A
TA
Operating free-air temperature(3)
–40
85
°C
TJ
Maximum junction temperature
125
125
°C
TLEAD
Maximum lead temperature (10-s soldering time)
300
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)],
the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max))
7.3 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature
–65
150
°C
Human-Body Model (HBM)(2)
2000
V
ESD(1)
Electrostatic discharge protection
Charged-Device Model (CDM)(3)
500
V
(1)
Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
(2)
Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe
manufacturing with a standard ESD control process.
(3)
Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250V CDM allows safe
manufacturing with a standard ESD control process.
7.4 Thermal Information
TPS22993
THERMAL METRIC(1)(2)
UNIT
RLW
(20 TERMINALS)
ΘJA
Junction-to-ambient thermal resistance
58
ΘJC(top)
Junction-to-case(top) thermal resistance
24
ΘJB
Junction-to-board thermal resistance
10
°C/W
ΨJT
Junction-to-top characterization parameter
0.7
ΨJB
Junction-to-board characterization parameter
10
ΘJC(bottom)
Junction-to-case(bottom) thermal resistance
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
Copyright © 2013–2014, Texas Instruments Incorporated
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