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TPS3307-25DGN датащи(PDF) 4 Page - Texas Instruments |
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TPS3307-25DGN датащи(HTML) 4 Page - Texas Instruments |
4 / 20 page www.ti.com TPS3307Y Chip Information 56 48 TPS3307Y (1) (2) (3) (5) (6) CHIP THICKNESS: 10 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJ max = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS (4) (7) (8) TPS3307-18, TPS3307-25, TPS3307-33 SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 These chips, when properly assembled, display characteristics similar to those of the TPS3307. Thermal compression or ultrasonic bonding may take place on the doped aluminium bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. Table 2. Terminal Functions TERMINAL I/O DESCRIPTION NAME NO. GND 4 Ground MR 7 I Manual reset RESET 5 O Active-low reset output RESET 6 O Active-high reset output SENSE1 1 I Sense voltage input 1 SENSE2 2 I Sense voltage input 2 SENSE3 3 I Sense voltage input 3 VDD 8 Supply voltage 4 Submit Documentation Feedback |
Аналогичный номер детали - TPS3307-25DGN |
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Аналогичное описание - TPS3307-25DGN |
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