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SN74LVC1G19DBVR датащи(PDF) 1 Page - Texas Instruments

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номер детали SN74LVC1G19DBVR
подробное описание детали  1-OF-2 DECODER/DEMULTIPLEXER
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производитель  TI [Texas Instruments]
домашняя страница  http://www.ti.com
Logo TI - Texas Instruments

SN74LVC1G19DBVR датащи(HTML) 1 Page - Texas Instruments

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SN74LVC1G19
1OF2 DECODER/DEMULTIPLEXER
SCES464B − JUNE 2003 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Supports 5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 4 ns at 3.3 V
D Low Power Consumption, 10-µA Max ICC
D ±24-mA Output Drive at 3.3 V
D Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This decoder/demultiplexer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it
to the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Reel of 3000
SN74LVC1G19YEPR
_ _ _CY_
−40 C to 85 C
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Reel of 3000
SN74LVC1G19YZPR
_ _ _CY_
−40
°C to 85°C
SOT (SOT-23) − DBV
Reel of 3000
SN74LVC1G19DBVR
C19_
SOT (SOT-23) − DBV
Reel of 250
SN74LVC1G19DBVT
C19_
SOT (SC-70) − DCK
Reel of 3000
SN74LVC1G19DCKR
CY_
SOT (SC-70) − DCK
Reel of 250
SN74LVC1G19DCKT
CY_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
A
GND
E
Y0
VCC
Y1
3
2
1
4
5
6
E
GND
A
Y1
VCC
Y0
YEP OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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