Page 6

Formosa MS

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Document ID

Issued Date

Revised Date

Revision

Page.

1.Storage environment: Temperature=5

~40

Humidity=55% 25%

2.Reflow soldering of surface-mount devices

±

oo

CC

Suggested thermal profiles for soldering processes

Profile Feature

Soldering Condition

Average ramp-up rate(T to T )

<3

/sec

Preheat

-Temperature Min(Tsmin)

150

-Temperature Max(Tsmax)

200

-Time(min to max)(t )

60~120sec

Tsmax to T

-Ramp-upRate

<3

/sec

Time maintained above:

-Temperature(T )

217

-Time(t )

60~260sec

Peak Temperature(T )

255

0/ 5

Time within 5

of actual Peak

Temperature(t )

Ramp-down Rate

<3

/sec

Time 25

to Peak Temperature

<6minutes

LP

s

L

L

L

P

P

o

o

o

o

o

oo

o

o

o

C

C

C

C

C

C-

+

C

C

C

C

10~30sec

3.Reflow soldering

Critical Zone

TL to TP

Critical Zone

TL to TP

TL

Tsmax

Tsmin

Ramp-up

Tp

tS

Preheat

t25 C to Peak

o

Time

25

TL

TP

Ramp-down

SL22-MHT THRU SL24-MHT

DS-121685

2012/03/16

-

A

7

Reel packing

SOD-123HT

7"

3,000

4.0

30,000

183*123*183

178

382*257*387

240,000

9.0

PACKAGE

REEL SIZE

REEL

COMPONENT

SPACING

BOX

INNER

BOX

REEL

DIA,

CARTON

SIZE

CARTON

APPROX.

GROSS WEIGHT

(kg)

(pcs)

(m/m)

(m/m)

(m/m)

(pcs)

(m/m)

(pcs)

Chip

Rectifier

Low VF Schottky Barrier