74LVCH244A

Document number: DS35889 Rev. 1 - 2

5 of 10

www.diodes.com

July 2014

© Diodes Incorporated

74LVCH244A

Switching Characteristics

Symbol

Parameter

Test Conditions

+85°C

+125°C

Unit

Min

Typ

Max

Min

Max

Min

Max

Propagation

Figure 1

1.8V ± 0.15V

1

5.9

12

1

12.2

1

12.4

ns

2.5V ± 0.2V

1

4.2

7.8

1

8.4

1

10

2.7V

1

4.2

8.2

1

8.9

1

9

3.3V ± 0.3V

1.5

3.9

7.7

1.5

8.2

1.5

8.3

Enable Time

Figure 1

1.8V ± 0.15V

1

6.4

12.1

1

12.6

1

14.1

ns

2.5V ± 0.2V

1

4.6

9.1

1

9.6

1

11.7

2.7V

1

5

8.4

1

8.6

1

10.3

3.3V ± 0.3V

1.5

4.5

7.4

1.5

7.6

1.5

9.4

Disable Time

Figure 1

1.8V ± 0.15V

1

5.8

11.6

1

12.1

1

13.6

ns

2.5V ±

0.2V

1

3.7

7.3

1

7.8

1

9.9

2.7V

1

3.8

6.6

1

6.8

1

8.6

3.3V ± 0.3V

1.5

3.8

6.3

1.5

6.5

1.5

8

Output Skew

Time

3.3V ± 0.3V

—

—

1.0

—

—

—

1.5

ns

Operating Characteristics

Symbol

Parameter

Test Conditions

Typ

Unit

Power dissipation

capacitance per gate

F = 10 MHz

Outputs Enabled

1.8V ± 0.15V

9.9

pF

2.5V ±

0.2V

10.2

3.3V ± 0.3V

10.6

Package Characteristics

Symbol

Parameter

Package

Test Conditions

Min

Typ

Max

Unit

Thermal Resistance

Junction-to-Ambient

TSSOP-20

(Note 8)

—

74

—

°C/W

Thermal Resistance

Junction-to-Case

TSSOP-20

(Note 8)

—

15

—

°C/W

Thermal Resistance

Junction-to-Ambient

V-QFN4525-20

(Note 8)

—

67

—

°C/W

Thermal Resistance

Junction-to-Case

V-QFN4525-20

(Note 8)

—

20

—

°C/W

Note:

8. Test conditions for TSSOP-20 and V-QFN4525-20: Devices mounted on 4 layer FR-4 substrate PC board, 2oz copper, with minimum recommended

pad layout per JESD 51-7.