поискавой системы для электроныых деталей |
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TS80C31X2 датащи(PDF) 10 Page - TEMIC Semiconductors |
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TS80C31X2 датащи(HTML) 10 Page - TEMIC Semiconductors |
10 / 24 page Qualpack TS80C31X2/C32X2 10 Rev. 2 – January 1999 4. Qualification Product Qualification Wafer Process Qualification Package Qualification Device Type (Design) Qualification All product qualifications are split into three distinct steps as shown above. This same procedure is also used to qualify a change. Before a product is released for use, it must have been manufactured using a qualified wafer and package process. Before a device is released for production processing, it must also have successfully completed its required specific qualification. The standard tests which are used for this procedure are shown in the section "Qualification Flow" |
Аналогичный номер детали - TS80C31X2 |
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Аналогичное описание - TS80C31X2 |
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