поискавой системы для электроныых деталей |
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TPS610994YFFR датащи(PDF) 4 Page - Texas Instruments |
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TPS610994YFFR датащи(HTML) 4 Page - Texas Instruments |
4 / 22 page 4 TPS61099, TPS610997 SLVSD88B – JULY 2016 – REVISED DECEMBER 2016 www.ti.com Product Folder Links: TPS61099 TPS610997 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage range at terminals(2) VIN, SW, VOUT, FB, EN -0.3 6.0 V Operating junction temperature, TJ –40 150 °C Storage temperature range, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500V HBM rating allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM rating allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged Device Model (CDM), per JEDEC specification JESD22- C101, all pins(2) ±500 7.3 Recommended Operating Conditions MIN NOM MAX UNIT VIN Input voltage range 0.7 5.5 V VOUT Output voltage range 1.8 5.5 V L Inductor 0.7 2.2 2.86 µH CIN Input capacitor 1.0 10 µF COUT Output capacitor 10 20 100 µF TJ Operating virtual junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPS61099 UNIT YFF (6 BALLS, WCSP) RθJA Junction-to-ambient thermal resistance 134.4 °C/W RθJCtop Junction-to-case (top) thermal resistance 0.9 °C/W RθJB Junction-to-board thermal resistance 36.1 °C/W ψJT Junction-to-top characterization parameter 0.1 °C/W ψJB Junction-to-board characterization parameter 36.2 °C/W RθJCbot Junction-to-case (bottom) thermal resistance N/A °C/W |
Аналогичный номер детали - TPS610994YFFR |
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Аналогичное описание - TPS610994YFFR |
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