Description: Giga-snaP BGA SMT Land Socket

256 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 16X16 array)

1

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

FR4/G10 or equivalent high temp material.

2

Top View

Side View

1

2

Status: Released

Drawing: S Natarajan

Scale: 4:1

Rev: B

Date: 3/2/05

Modified: 4/18/05

File: LS-BGA256E-41 Dwg

LS-BGA256E-41 Drawing

© 2005 IRONWOOD ELECTRONICS, INC.

PO BOX 21151 ST. PAUL, MN 55121

Tele: (651) 452-8100

www.ironwoodelectronics.com

LS-BGA256E-41 Drawing

Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.

A

th

b

F

w

A

a

17.00mm

[0.669"]

17.00mm

[0.669"]

1.68mm

[0.066"]

1.00mm

[0.039"]

1.00mm

[0.039"]

3.76mm

[0.148"]

0.20mm

[0.008"]±0.0005"

15.00mm

[0.591"]

1.00mm

[0.039"]