Si7540ADP

www.vishay.com

Vishay Siliconix

S16-2274-Rev. C, 14-Nov-16

3

Document Number: 62951

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Notes

a. Guaranteed by design, not subject to production testing.

b. Pulse test; pulse width

 300 μs, duty cycle 2 %.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

Turn-on delay time

N-channel

P-channel

N-Ch

-

12

25

ns

P-Ch

-

15

30

Rise time

N-Ch

-

45

90

P-Ch

-

50

100

Turn-off delay time

N-Ch

-

22

45

P-Ch

-

30

60

Fall time

N-Ch

-

12

25

P-Ch

-

11

20

Turn-on delay time

N-channel

P-channel

N-Ch

-

6

15

P-Ch

-

10

15

Rise time

N-Ch

-

21

40

P-Ch

-

23

45

Turn-off delay time

N-Ch

-

20

40

P-Ch

-

26

50

Fall time

N-Ch

-

10

20

P-Ch

-

10

20

Drain-Source Body Diode Characteristics

Continuous source-drain diode current

N-Ch

-

-

2.9

A

P-Ch

-

-

-2.9

Pulse diode forward current (t = 100 μs)

N-Ch

-

-

35

P-Ch

-

-

-25

Body diode voltage

N-Ch

-

0.8

1.2

V

P-Ch

-

-0.81

-1.2

Body diode reverse recovery time

N-channel

P-channel

N-Ch

-

20

40

ns

P-Ch

-

30

60

Body diode reverse recovery charge

N-Ch

-

10

20

nC

P-Ch

-

20

40

Reverse recovery fall time

N-Ch

-

8.5

-

ns

P-Ch

-

18

-

Reverse recovery rise time

N-Ch

-

11.5

-

P-Ch

-

12

-

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX

UNIT