поискавой системы для электроныых деталей |
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HLMP-3762 датащи(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-3762 датащи(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED |
11 / 11 page For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. Obsoletes 5989-4258EN AV02-1558EN - March 30, 2015 Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • Ifleadformingisrequiredbeforesoldering,caremustbe taken to avoid any excessive mechanical stress induced toLEDpackage.Otherwise,cuttheleadsofLEDtolength aftersolderingprocessatroomtemperature.Thesolder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mmbelowthebody(encapsulantepoxy)forthoseparts without standoff. • Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature 105 °C Max. – Pre-heat Time 30 sec Max. – Peak Temperature 250 °C Max. 260 °C Max. Dwell Time 3 sec Max. 5 sec Max. • Wave soldering parameter must be set and maintained accordingtorecommendedtemperatureanddwelltime in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Properhandlingisimperativetoavoidexcessivethermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size Diagonal Plated Through- Hole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shear- off area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) 1.05 to 1.15 mm (0.041 to 0.045 in) Dambar shear- off area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) Note: Refer to application note AN1027 for more information on soldering LED components. Figure 17. Recommended wave soldering profile LAMINAR WAVE BOTTOM SIDE OF PC BOARD HOT AIR KNIFE TURBULENT WAVE FLUXING PREHEAT 0 10 20 30 50 100 150 200 250 30 40 50 TIME – SECONDS 60 70 80 90 100 TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. |
Аналогичный номер детали - HLMP-3762 |
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Аналогичное описание - HLMP-3762 |
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