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HLMP-Y651 датащи(PDF) 1 Page - AVAGO TECHNOLOGIES LIMITED

номер детали HLMP-Y651
подробное описание детали  The junction temperature of the device determines
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производитель  AVAGO [AVAGO TECHNOLOGIES LIMITED]
домашняя страница  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-Y651 датащи(HTML) 1 Page - AVAGO TECHNOLOGIES LIMITED

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HLMP Y601/ Y651/Y701/Y801/ Y802/Y901/Y951
T-1 (3mm) AlInGaP LED Lamps
Data Sheet
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accor-
dance with the latest revision of JEDEC stds. Avago tests
parts at the absolute maximum rated conditions recom-
mended for the device.The actual performance you obtain
from Avago parts depends on the electrical and environ-
mental characteristics of your application but will prob-
ably be better than the performance outlined in Table 1.
Failure Rate Prediction
The junction temperature of the device determines the
failure rate of semiconductor devices. The relationship be-
tween ambient temperature and actual junction tempera-
ture is given by the following:
TJ(°C) = TA(°C) + θJAPAVG
where
TA = ambient temperature in °C
θJA = thermal resistance of junction-to-ambient in °C/Watt
PAVG = average power dissipated in Watt
The estimated MTBF and failure rate at temperatures lower
than the actual stress temperature can be determined by
using an Arrhenius model for temperature acceleration.
Results of such calculations are shown in the table below
using activation energy of 0.43V.
Table 1. Life Tests
Demonstrated Performance
Colors
Stress Test Conditions
Total
Device Hrs
Units
Tested
Units
Failed
Performance in Time (60% confidence)
MTBF[1]
Failure Rate
(%/1K Hours)
Green/Yellow/Amber/Red/
DeepRed/Red Orange
TA = +75°C
If = 20mA
84,000
84
0
91700
1.091


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